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$99
1.5TB
10 core
10-inch
10.1-inch
10.2-inch
10.5-inch
100GB
100w
1080p
10nm
11-inch
11.6-inch
11K
12-2.inch
12-inch
12.2-inch
12.5-inch
12.9-inch
128GB
128MB
12Gb
12MPx
13-inch
13.3-inch
14-inch
14nm
15-inch
15nm
16-nm
16GB
16nm
17-inch
18-inch
18.4-inch
180GB
18nm
19nm
1TB
2-in-1
2.1-inch
2.5-inch
20Gbps
20nm
21-inch
21.5-inch
22CV241
22nm
23-inch
23.8-inch
24-inch
24.1-inch
240GB
24MP76HM-S
2560 x 1080
256GB
27-inch
276E6ADS
28-inch
284E5QHAD
28nm
29-inch
29EA73-P
2GB
2K
2k games
3.5-inch
30-bit
30-inch
3200MHz
32GB
32nm
335 Series
34-inch
34nm
3840 x 2160
3d
3D NAND
3D Touch
3D Tri-gate
3D V-NAND
3dfxzone.it
3dmark
3g
3G HSPAplus
4-inch
4.7-inch
40nm
4g
4G LTE
4GB
4K
4k2k
4TB
5-inch
5.1-inch
5.2-inch
5.5-inch
5.7-inch
5120 x 2880 pixel
530
55-inch
5G
5K
5nm
6-inch
64-bit
6GB
6TB
7-inch
7-series
7.0-inch
7.85-inch
7.9-inch
7200RPM
7mm
7nm
8-inch
8.0-inch
8.4-inch
80 Plus Platinum
802.11ac
80GB
8400mAh
850 EVO
8Gb
9-series
9.7-inch
950 PRO
a-data
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A10
A10-7700K
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A15
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Android 6
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igzo
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Intrepid 3600
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ion
IOPS
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iOS 7
iOS 8
iOS 9
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Moorefield
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MX239HR
My Mobile. My Moment
mysql
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NEC Display Solutions of America
Need for Speed Most Wanted
Need for Speed No Limits
Need for Speed Rivals
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NenaMark2
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Network Function Virtualization
Network-Attached Storage
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Neutron Series GTX
new zealand
Next Unit of Computing
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Nexus 5
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Nexus One
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NFC
NFV
NGFF
NH-U12DX i4
NH-U9DX i4
NiC Series
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Nolan
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NTT docomo
NUBES
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nuova generazione
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Oculus
ocz
ODM
oel
oem
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Office 365 Home Premium
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Onda
ondata
One
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ooocrackz
open
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Abbiamo pubblicato 2 documenti correlati con il tag Kirin 980
Pagina 1 di 1
Foto high quality e specifiche degli smartphone P30 Pro e P30 di Huawei Sono on line le seguenti foto in alta qualità della linea completa P30 che Huawei si appresta ad annunciare ufficialmente tra pochi giorni. In base alle informazioni provenienti
dai canali non ufficiali, la linea P30 di Huawei include due smartphone, denominati dal marketing rispettivamente P30 e P30 Pro.
Huawei P30 Pro
Per quanto concerne... »
La produzione dei SoC Kirin 980 per Mate 20 Pro parte nel quarto trimestre La produzione in volumi del SoC per smartphone Kirin 980 di HiSilicon, effettuata mediante il nodo a 7nm FinFET dal maker taiwanese TSMC, avrà inizio nel corso del quarto trimestre dell'anno 2018.
Questi chip, in accordo a un report proveniente da Digitimes Research, saranno utilizzati da Huawei per l'equipaggiamento della sua soluzione flag-ship... »
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